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Effect of Non-Linear Mechanical Properties on Thermal Fatigue for Aluminum Wire Bonding of Power Module
205 Strain Evaluation of The Micro-structures in Electronic Packages Using The Digital Image Correlation Method
Review of Methodologies for Structural Integrity Evaluation of Power Modules
Evaluation for reliability of organic thin film transistor using bending test
103 Accuracy Improvement of Strain Measurement Using Digital Image Correlation for Images Obtained by a Laser Scanning Microscope
Study of thermal crack under electric current
119 The Study of Evaluation for Reliability of Flexible Device Using Bending Test
Methodologies for Structural Integrity Evaluation of Power Semiconductor Modules
OS0512 Effect of environment on the fatigue behavior of single crystalline silicon
In-situ observation of flexible organic transistor during bending test
Application of Nonlinear Fracture Mechanics to Mechanical Reliability Evaluation of Power Device
Synthesis of Some 8, 8-Disubstituted Heptafulvene Derivatives
Application of Creep Multi-linear Rule to ORNL Modified Strain Hardening of Al Wire Bonding in Power Module
526 Effect of hydrogen on the plastic properties of single crystal silicon
723 Measurement of the Strain Field around a Crack Tip in Epoxy Resin modified with Submicron-Rubber-Particles
Evaluation of bending deformation and fracture behavior on multilayered thin film structure using mechanoluminescence