Justice Chukwudi Okoro

Advanced search ?

Discover the optimal journal based on multiple criteria or locate authors along with their published articles and the corresponding journals.

Publisher

* You can search a publisher or tap the name directly

Subject Area

* You can search a subject area or tap the name directly

Open Acess

Yes

Quartille

Q1
Q3

Q2
Q4

You can also search
by the journal's Country or the impact indicator H-index.

Countries

* You can search a country or tap the name directly

H-Index

* You can also filter by Journal H-index

15 Publications

Publication								Year
Evaluation of the helium hermeticity reliability of copper through-glass vias Authors : Chukwudi Okoro , Pamela Maurey , Ronald Davis , Scott Pollard Journal : Microelectronics Reliability Journal Reference count : 23 Volume : 137 Pages : 114783								2022
Creativity Inherent in Abigbo Performance Composition: Use of Imagery and Musical Repetitions Authors : Justice Chukwudi Okoro Journal : UJAH: Unizik Journal of Arts and Humanities Volume : 22 Pages : 240-277								2021
Evidences and Applications of Proverbs, Parallelism, Fables in Abigbo Musical Structure Authors : Okoro, Justice Chukwudi Journal : International Journal of Music and Performing Arts Volume : 9								2021
Abigbo’s Identity in Music Making and Repertory of Songs: The Mbaise People’s Heritage Authors : Justice Chukwudi Okoro , Festus Goziem Okubor Journal : UJAH: Unizik Journal of Arts and Humanities Volume : 21 Pages : 170-194								2021
Understanding and eliminating thermo-mechanically induced radial cracks in fully metallized through-glass via (TGV) substrates Authors : Chukwudi Okoro , Shrisudersan Jayaraman , Scott Pollard Journal : Microelectronics Reliability Journal Reference count : 40 Volume : 120 Pages : 114092								2021
Time and Temperature Dependence of Copper Protrusion in Metallized Through-Glass Vias (TGVs) Fabricated in Fused Silica Substrate Authors : Chukwudi Okoro , Pamela Maurey , Scott Pollard Journal : IEEE Transactions on Device and Materials Reliability Journal Reference count : 43 Volume : 21 Pages : 129-136								2021
Elimination of Thermo-Mechanically Driven Circumferential Crack Formation in Copper Through-Glass via Substrate Authors : Chukwudi Okoro , Ah-Young Park , Tammie Allowatt , Scott Pollard Journal : IEEE Transactions on Device and Materials Reliability Journal Reference count : 18 Volume : 21 Pages : 354-360								2021
The effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study Authors : Omar Ahmed , Chukwudi Okoro , Scott Pollard , Tengfei Jiang Journal : Multidiscipline Modeling in Materials and Structures Journal Reference count : 35 Volume : 17 Pages : 451-464								2020
The Press and Nigeria’s Foreign Policy: A Content Analysis of Selected Issues (1985 – 1995)<br />   Authors : K.O. Nworgu , Chukwudi Obi , Nnanyelugo Okoro Journal : Online Journal of Communication and Media Technologies Volume : 8								2018
Full elastic strain and stress tensor measurements from individual dislocation cells in copper through-Si vias Authors : Lyle E. Levine , Chukwudi Okoro , Ruqing Xu Journal : IUCrJ Journal Reference count : 18 Volume : 2 Pages : 635-642								2015
Experimental measurement of the effect of copper through-silicon via diameter on stress buildup using synchrotron-based X-ray source Authors : Chukwudi Okoro , Lyle E. Levine , Ruqing Xu , Yaw Obeng Journal : Journal of Materials Science Journal Reference count : 41 Volume : 50 Pages : 6236-6244								2015
Defect and microstructural evolution in thermally cycled Cu through-silicon vias Authors : James Marro , Chukwudi Okoro , Yaw Obeng , Kathleen Richardson Journal : Microelectronics Reliability Journal Reference count : 28 Volume : 54 Pages : 2586-2593								2014
Measurement Science for "More-Than-Moore" Technology Reliability Assessments Authors : Y. Obeng , Chukwudi Okoro , Joseph Kopanski Journal : ECS Meeting Abstracts Volume : MA2012-02 Pages : 2792-2792								2012
A case study on the impact of local material chemistry on the mechanical reliability of packaged integrated circuits: Correlation of the packaging fallout to the chemistry of passivation dielectrics Authors : Chukwudi A. Okoro , Yaw S. Obeng Journal : Thin Solid Films Journal Reference count : 18 Volume : 520 Pages : 5060-5063								2012
(Invited) Impact of Thermal Stability of Isolation Liner on the Electrical Characteristics of TSVs Authors : Chukwudi Okoro , Annas Afzal , Binayak Kandel , Yaw S. Obeng Journal : ECS Transactions Volume : 45 Pages : 217-223								2012

Research Support Chat

Justice chukwudi okoro

15 Publications

Home

Indexing Services

Customer Service

Research Support Chat

Advanced search ?

You can also search by the journal's Country or the impact indicator H-index.

Justice chukwudi okoro

15 Publications

You can also search
by the journal's Country or the impact indicator H-index.